HRC48 - 55 Wafer Frame Ring Dicing Ring

Mechanical Polishing Glossy Ra<0.15um Hardness HRC48-55 Wafer Dicing Frame Ring ES-WFR-Dura420

1. Introduction of Mechanical Polishing Glossy Ra<0.15um Hardness HRC48-55 Wafer Dicing Frame Ring ES-WFR-Dura420

Wafer frame ring ES-WFR-Dura420 is made of German Dura420 high hardness stainless steel plate, which can ensure the right performance as wafer metal ring. It is also known or named as wafer frame, wafer mounting ring, wafer loading ring, wafer dicing ring, wafer metal ring, wafer ring frame or wafer frame ring.   

Wafer frame ringES-WFR-Dura420 can provide safe support during the process of wafer or chip shipping and handling operations. Such wafer dicing ring is featuring extremely light weight and reliable shaping performance. We have many end users of wafer or chip producers globally around the world.

2. Technical parameter of Mechanical Polishing Glossy Ra<0.15um Hardness HRC48-55 Wafer Dicing Frame Ring ES-WFR-Dura420

Technical parameters for EASTAR® wafer frame ring:

1).     Material: German Dura420stainless steel

2).     Wafer frame ring thickness and sizes:

1) 06 inches

(External diameter Φ228mm/ inner diameterΦ194mm/ Thickness 1.2mm
2) 08 inches

(External diameter Φ276mm / inner diameterΦ250mm/ Thickness 1.2mm
3) 12 inches

(External diameter Φ400mm / inner diameterΦ350mm/ Thickness 1.5mm 

3).     Surface treatment: Mechanical Polishing/ glossy surface Ra<0.15um/matte surface Ra>0.3um/mirror surface Ra<0.05um

4).     Surface Hardness: HRC48-55

5).     Size tolerance: +/-0.5mm

6).     Angle tolerance: 0° 30″.

7).     Flatness level: ＜0.2mm

Ring shape: Inner circular shape, Inner square shape and special customized shapes.  All the shapes and sizes can be customized as per the user drawing.

3. Application of Mechanical Polishing Glossy Ra<0.15um Hardness HRC48-55 Wafer Dicing Frame Ring ES-WFR-Dura420

EASTAR® Wafer frame ringES-WFR-Dura420 (also named as Wafer Dicing Ring/Wafer Metal Frame/Wafer Metal Ring/Wafer Ring Frame/Wafer Frame Ring) is working as a circular or special shape metal ring used to protect the edges of wafers and chips, mainly used in the laser marking process of wafers to provide protection and position limit. The wafer frame ring can withstand the high temperature and energy during the UV laser marking process to prevent chip damage and edge fragmentation.