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SUS301H Pin Lam Glossy Finish Copper Clad Laminate Plate CCL Thin Copper Clad Pcb

Product Details

Place of Origin: CHINA

Brand Name: EastStar

Model Number: ESSP-S301

Payment & Shipping Terms

Minimum Order Quantity: 100pcs

Price: Negotiable

Packaging Details: exported plywood case

Delivery Time: about 10-15days after getting advance payment

Payment Terms: T/T

Get Best Price
Highlight:

SUS301H Copper Clad Laminate Plate

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Glossy Finish Copper Clad Laminate Plate

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copper clad pcb

Surface Finish:
Ra≤0.14um/Rz≤1.50um
Surface Finish:
Glossy
Parallelism:
≤0.03
Width:
≤1300
Standard Bushing Slot Tolerance:
+0.10/-0mm
High Temperature Resistance Performance:
≤280℃
Application:
CCL Lamination
Thermal Conductivity:
≥15W/MK At 300℃
Steel Material:
SUS301H.
Normal Thickness (mm)::
0.5mm,1.0mm, 1.2mm
Surface Finish:
Ra≤0.14um/Rz≤1.50um
Surface Finish:
Glossy
Parallelism:
≤0.03
Width:
≤1300
Standard Bushing Slot Tolerance:
+0.10/-0mm
High Temperature Resistance Performance:
≤280℃
Application:
CCL Lamination
Thermal Conductivity:
≥15W/MK At 300℃
Steel Material:
SUS301H.
Normal Thickness (mm)::
0.5mm,1.0mm, 1.2mm
SUS301H Pin Lam Glossy Finish Copper Clad Laminate Plate CCL Thin Copper Clad Pcb

SUS301H Japanese Material Pin-Lam Plate Glossy Finish Copper Clad Laminate Plate CCL Thin Press Plate ESSP-S301

Product Description of SUS301H Japanese Material Pin-Lam Plate Glossy Finish Copper Clad Laminate Plate CCL Thin Press Plate ESSP-S301:

The Copper Clad Laminate Plate is a high-quality product designed for CCL lamination applications. Made from durable Steel SUS301H material, this plate is specially crafted to meet the demanding requirements of the lamination process.

 

With a maximum length of ≤2410, the Copper Clad Laminate Plate offers ample space for various lamination tasks, providing flexibility and versatility in different work settings. The precise design ensures parallelism of ≤0.03, guaranteeing accurate and consistent lamination results every time.

 

One of the key features of this plate is its warpage degree of ≤3mm/M, which contributes to the overall stability and reliability of the lamination process. This minimal warpage degree helps maintain the integrity of the materials being laminated, ensuring a smooth and efficient operation.

 

Constructed as a steel press plate, the Copper Clad Laminate Plate is built to withstand the rigors of lamination tasks, offering durability and longevity in demanding work environments. The use of Steel SUS301H material further enhances the strength and resilience of the plate, making it a reliable tool for various lamination applications.

 

Whether you are working on small-scale projects or large-scale productions, the Copper Clad Laminate Plate is a dependable choice for achieving high-quality lamination results. Its precision engineering and robust construction make it an essential tool for professionals in the lamination industry.

 

Models

Items

SUS301H Japan
Mass-Lam plate Pin-lam plate
Thickness 1.0-2.0mm 1.0-2.0mm
Width ≤1300 ≤1300
Length ≤2410 ≤2410
Thickness tolerance ±0.10 ±0.10
Surface roughness (um)

Ra≤0.15

Rz≤1.5

Ra≤0.15

Rz≤1.5

Positioning hole to hole tolerance -- +/-0.10
Standard bushing slot tolerance -- +0.10/-0mm
Warpage degree ≤3mm/M ≤3mm/M
L/W size tolerance ±1mm ±1mm
Hardness HRC ≥450HRC ≥450HRC
Work temperature ≤280℃ ≤280℃
Parallelism ≤0.03 ≤0.03
Diagonal deviation 1-2mm 1-2mm
Thermal conductivity 15W/MK 15W/MK at 300℃
Average thermal expansion coefficient (10-6/℃) 17 17
Surface finish Ra≤0.14um/Rz≤1.50um Ra≤0.14um/Rz≤1.50um


 

Features of SUS301H Japanese Material Pin-Lam Plate Glossy Finish Copper Clad Laminate Plate CCL Thin Press Plate ESSP-S301:

  • Product Name: Copper Clad Laminate Plate
  • Parallelism: ≤0.03
  • Application: CCL Lamination
  • Length: ≤2410
  • Hardness HRC: 450HRC
  • Average thermal expansion coefficient (10-6/℃): 17
 

Technical Parameters of SUS301H Japanese Material Pin-Lam Plate Glossy Finish Copper Clad Laminate Plate CCL Thin Press Plate ESSP-S301:

Technical Parameter Value
High temperature resistance performance ≤280℃
Hardness HRC 450HRC
Width ≤1300
Material Steel SUS301H
Average thermal expansion coefficient (10-6/℃) 17
Parallelism ≤0.03
Warpage degree ≤3mm/M
Thickness 0.5mm, 1.0mm, 1.2mm
Length ≤2410
Standard bushing slot tolerance +0.10/-0mm
 

Applications of SUS301H Japanese Material Pin-Lam Plate Glossy Finish Copper Clad Laminate Plate CCL Thin Press Plate ESSP-S301:

1. CCL Press Plate: The EastStar Copper Clad Laminate Plate is ideal for use in CCL press machines for manufacturing printed circuit boards (PCBs). Its high hardness of 450HRC ensures durability and longevity during the pressing process.

 

2. CCL lamination plate: When it comes to laminating copper foils onto substrates, the ESSP-S301 plate offers excellent performance. Its high temperature resistance of up to 280℃ makes it suitable for the lamination process without compromising quality.

 

3. PCB/CCL PCB partition steel plate: The EastStar Copper Clad Laminate Plate can be used as a partition steel plate in PCB/CCL PCB manufacturing. With a standard bushing slot tolerance of +0.10/-0mm, it ensures precise and accurate partitioning of PCBs for different applications.

 

Whether in electronics, telecommunications, automotive, or aerospace industries, the EastStar Copper Clad Laminate Plate finds its utility in a wide range of applications. Its width of up to 1300 allows for flexibility in design and customization, catering to specific project requirements.

Furthermore, the minimum order quantity of 100pcs makes it accessible for both small-scale and large-scale production needs. The negotiable pricing, along with the convenient payment terms of T/T, adds to the product's value proposition.

 

Delivered in exported plywood cases, the EastStar Copper Clad Laminate Plate ensures safe transportation and storage. With a delivery time of about 10-15 days after receiving the advance payment, customers can rely on timely fulfillment of their orders.

 

In conclusion, the EastStar Copper Clad Laminate Plate (Model: ESSP-S301) stands out as a reliable and versatile material for CCL pressing, lamination, and PCB partitioning applications, offering quality, precision, and durability for various industrial needs.

 

Customization of SUS301H Japanese Material Pin-Lam Plate Glossy Finish Copper Clad Laminate Plate CCL Thin Press Plate ESSP-S301:

Product Customization Services for the Copper Clad Laminate Plate:

Brand Name: EastStar

Model Number: ESSP-S301

Place of Origin: China

Minimum Order Quantity: 100pcs

Price: Negotiable

Packaging Details: exported plywood case

Delivery Time: about 10-15 days after getting advance payment

Payment Terms: T/T

Application: CCL Lamination

Surface Finish: Glossy, Ra≤0.14um/Rz≤1.50um

Thickness: 0.5mm, 1.0mm, 1.2mm

Material: Steel SUS301H

 

Support and Services of  SUS301H Japanese Material Pin-Lam Plate Glossy Finish Copper Clad Laminate Plate CCL Thin Press Plate ESSP-S301:

Our Product Technical Support and Services for the Copper Clad Laminate Plate include:

- Detailed product specifications and technical data sheets

- Assistance with product selection and recommendations

- Troubleshooting and problem-solving guidance

- Installation and usage instructions

- Warranty information and support

 

Packing and Shipping of SUS301H Japanese Material Pin-Lam Plate Glossy Finish Copper Clad Laminate Plate CCL Thin Press Plate ESSP-S301:

Product: Copper Clad Laminate Plate

Package Contents: 1 Copper Clad Laminate Plate

Package Type: Securely wrapped in bubble wrap

Shipping Method: Standard shipping

Shipping Time: Estimated delivery within 10-15 business days

SUS301H Pin Lam Glossy Finish Copper Clad Laminate Plate CCL Thin Copper Clad Pcb 0SUS301H Pin Lam Glossy Finish Copper Clad Laminate Plate CCL Thin Copper Clad Pcb 1