Eaststar New Material (Tianjin) Limited
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घर > उत्पादों > गर्म प्रेस कुशन पैड > High Temperature Resistance ≤280℃ Hot Press Cushion Pad with Water Absorption < 8% and Buffer Standard ≥ 12% for PCB Lamination

High Temperature Resistance ≤280℃ Hot Press Cushion Pad with Water Absorption < 8% and Buffer Standard ≥ 12% for PCB Lamination

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Place of Origin: China

ब्रांड नाम: EastStar

Model Number: ESCP-PCB-G2

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Minimum Order Quantity: 10pcs

मूल्य: विनिमय योग्य

Packaging Details: exported plywood case

Delivery Time: about 10-15days after getting prepayment

Payment Terms: T/T

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प्रमुखता देना:

High Temperature Resistance Hot Press Cushion Pad

,

Water Absorption PCB Laminating Pad

,

Buffer Standard Lamination Press Rubber Pad

Water absorption standard ::
< 8% (3-8%)
Weight:
Based On The Size And Thickness
Material:
Rubber
Buffer standard: :
≥ 12%
High temperature resistance performance:
≤280℃
Tensile strength::
≥ 25 MPa
Shape:
Square
Thickness:
4mm-6.5mm (for Top/bottom Cushion Pad)/1.5-2.0mm (for Middle Layer Cushion Pad).
Water absorption standard ::
< 8% (3-8%)
Weight:
Based On The Size And Thickness
Material:
Rubber
Buffer standard: :
≥ 12%
High temperature resistance performance:
≤280℃
Tensile strength::
≥ 25 MPa
Shape:
Square
Thickness:
4mm-6.5mm (for Top/bottom Cushion Pad)/1.5-2.0mm (for Middle Layer Cushion Pad).
High Temperature Resistance ≤280℃ Hot Press Cushion Pad with Water Absorption < 8% and Buffer Standard ≥ 12% for PCB Lamination
Hot Press Cushion Pad
Available in standard sizes: 1500×1300mm, 1300×780mm, 1170×690mm, 1160×665mm, 1180×660mm, and 1295×788mm. This high-performance cushion pad features excellent temperature resistance and a buffer standard of 12%.
Product Overview
The Hot Press Cushion Pad is an essential accessory designed to enhance efficiency and durability in lamination and pressing processes. Manufactured from high-quality rubber, this product delivers exceptional performance and reliability for various industrial and commercial applications.
Key Features
  • High-temperature resistance up to ≤280℃
  • Water absorption standard less than 8% (3-8%)
  • Tensile strength ≥ 25 MPa
  • Square design for uniform pressure distribution
  • Available in white, black, and yellow colors
  • Material thickness: 4mm-6.5mm (Top/Bottom), 1.5-2.0mm (Middle Layer)
  • Service life: 300-500 usage cycles
Technical Specifications
Parameter Specification
Available Sizes 1500×1300mm, 1300×780mm, 1170×690mm, 1160×665mm, 1180×660mm, 1295×788mm
Shape Square
Buffer Standard ≥ 12%
Tensile Strength ≥ 25 MPa
Service Life 300-500 Times
Material Rubber
Colors White, Black, Yellow
Water Absorption < 8% (3-8%)
Applications
The EastStar Hot Press Cushion Pad (Model: ESCP-PCB-G2) is specifically designed for rigid printed circuit board lamination processes. It ensures precise pressure and temperature control in hot press machines, making it ideal for electronics manufacturing plants, PCB fabrication workshops, and research laboratories.
Frequently Asked Questions
What is the brand and model number of the Hot Press Cushion Pad?
The Hot Press Cushion Pad is branded EastStar, and the model number is ESCP-PCB-G2.
Where is the Hot Press Cushion Pad manufactured?
This product is made in China.
What is the minimum order quantity for the Hot Press Cushion Pad?
The minimum order quantity is 10 pieces.
How is the Hot Press Cushion Pad packaged for shipment?
It is packaged in an exported plywood case to ensure safe delivery.
What are the payment terms and delivery time?
Payment is accepted via T/T, and delivery time is approximately 10-15 days after receiving prepayment.
Is the price of the Hot Press Cushion Pad fixed?
The price is negotiable depending on order quantity and specific requirements.
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