Highlight:
0.5mm PCB Lamination Steel Plate
, SUS301H PCB Lamination Steel Plate
, Thin plate mount pcb
Material: |
SUS301H. |
Normal Thickness (mm):: |
0.5, 1.0, 1.2. |
Normal Sizes Of Copper Clad Laminate CCL Lamination Steel Plate/press Plate (L * W In Mm):: |
1910*1270/2210*1270/2220*1270. |
Normal Sizes Of PCB Lamination Steel Plate/press Plate (L*W In Mm):: |
1500*1295/1300*800/1295*787/1295*1613/1295*1143/1295*787/1285*750/1280*1120/1280*1070/1280*970/1270*1118/1270*1070/1143*660/673*571/660*508/24"*28". |
Surface Finish: |
Ra≤0.14um/Rz≤1.50um |
Average Thermal Expansion Coefficient (10-6/℃): |
17 |
Thermal Conductivity: |
15W/MK |
Work Temperature: |
≤280℃ |
Parallelism: |
≤0.03 |
Diagonal Deviation: |
1-2mm |
0.5mm SUS301H PCB Lamination Steel Plate Thin Press Plate
0.5mm Thickness Steel Material SUS301H PCB Lamination Steel Plate Thin Press Plate ESSP-S301
1.Introduction of 0.5mm Thickness Steel Material SUS301H PCB Lamination Steel Plate Thin Press Plate ESSP-S301
PCB/CCL Thin Press Plate ESSP-S301 is featuring thin sheet thickness by using high quality Japanese or German raw material steel with the steel model of SUS301H, which has more competitive pricing advantage with the great quality reliability.
By using thinner press plate, the laminated layer number can be increased for bigger productivity target. It can also lower the temperature difference of different layers in the laminator, which can improve the increasing and decreasing location.
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 Models
Items
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SUS301H Japan
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Mass-Lam plate
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Pin-lam plate
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Thickness
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1.0-2.0mm
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1.0-2.0mm
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Width
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≤1300
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≤1300
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Length
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≤2410
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≤2410
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Thickness tolerance
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±0.10
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±0.10
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Surface roughness (um)
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Ra≤0.15
Rz≤1.5
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Ra≤0.15
Rz≤1.5
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Positioning hole to hole tolerance
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--
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+/-0.10
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Standard bushing slot tolerance
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--
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+0.10/-0mm
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Warpage degree
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≤3mm/M
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≤3mm/M
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L/W size tolerance
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±1mm
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±1mm
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Hardness HRC
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≥450HRC
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≥450HRC
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Work temperature
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≤280℃
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≤280℃
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|
Parallelism
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≤0.03
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≤0.03
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Diagonal deviation
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1-2mm
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1-2mm
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Thermal conductivity
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15W/MK
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15W/MK at 300℃
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Average thermal expansion coefficient (10-6/℃)
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17
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17
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Surface finish
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Ra≤0.14um/Rz≤1.50um
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Ra≤0.14um/Rz≤1.50um
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2. Product features of 0.5mm Thickness Steel Material SUS301H PCB Lamination Steel Plate Thin Press Plate ESSP-S301
Key features of Printed Circuit Board PCB/CCL Thin Press Plate ESSP-S301:
1). More competitive pricing advantage with reliable lamination performance.
2). The thinner plate has better thermal conductivity and thermal expansion coefficient, which can solve the issue of copper plate wrinkling problem.
3). Suitable for various types of lamination steel plate washing machines
3. Technical parameters of 0.5mm Thickness Steel Material SUS301H PCB Lamination Steel Plate Thin Press Plate ESSP-S301
1). Steel material: SUS301H.
2). Normal thickness (mm): 0.5, 1.0, 1.2.
3).Normal sizes of PCB lamination steel plate/press plate (L*W in mm): 1500*1295/1300*800/1295*787/1295*1613/1295*1143/1295*787/1285*750/1280*1120/1280*1070/1280*970/1270*1118/1270*1070/1143*660/673*571/660*508/24"*28".
4). Normal sizes of copper clad laminate CCL lamination steel plate/press plate (L * W in mm):
1910*1270/2210*1270/2220*1270.
4. Performance parameters of 0.5mm Thickness Steel Material SUS301H PCB Lamination Steel Plate Thin Press Plate ESSP-S301
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Steel material
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SUS301H
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Normal thickness (mm):
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0.5,1.0, 1.2,
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|
Normal sizes of PCB lamination steel plate/press plate (L*W in mm):
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1500*1295/1300*800/1295*787/
1295*1613/1295*1143/1295*787/
1285*750/1280*1120/1280*1070/1280*970/
1270*1118/1270*1070/1143*660/673*571/660*508/24"*28"..
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Normal sizes of copper clad laminate CCL lamination steel plate/press plate (L * W in mm):
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1910*1270/2210*1270/2220*1270.
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