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300-500 Times Service Life High Temperature Resistance ≤280℃ Square Hot Press Cushion Pad for PCB Lamination

Product Details

Place of Origin: China

Brand Name: EastStar

Model Number: ESCP-PCB-G2

Payment & Shipping Terms

Minimum Order Quantity: 10pcs

Price: Negotiable

Packaging Details: exported plywood case

Delivery Time: about 10-15days after getting prepayment

Payment Terms: T/T

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Highlight:

300-500 Times Service Life Hot Press Cushion Pad

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High Temperature Resistance ≤280℃ PCB Lamination Pad

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Square Shape Buffering Pad

Tensile Strength::
≥ 25 MPa
Shape:
Square
Material:
Rubber
High Temperature Resistance Performance:
≤280℃
Water Absorption Standard ::
< 8% (3-8%)
Usage:
Rigid Printed Circuit Board Lamination
Buffer Standard: :
≥ 12%
Service Life:
300-500 Times
Tensile Strength::
≥ 25 MPa
Shape:
Square
Material:
Rubber
High Temperature Resistance Performance:
≤280℃
Water Absorption Standard ::
< 8% (3-8%)
Usage:
Rigid Printed Circuit Board Lamination
Buffer Standard: :
≥ 12%
Service Life:
300-500 Times
300-500 Times Service Life High Temperature Resistance ≤280℃ Square Hot Press Cushion Pad for PCB Lamination
Hot Press Cushion Pad for PCB Lamination
The Hot Press Cushion Pad is an essential accessory designed specifically for high-performance lamination processes, particularly suited for rigid printed circuit board (PCB) lamination. Crafted from premium-quality rubber, this pad serves as a reliable buffering pad that ensures uniform pressure distribution and optimal heat transfer during the lamination press process.
Key Features
  • Material: High-quality rubber for durability and flexibility
  • Tensile Strength: ≥ 25 MPa, ensuring strong resistance to stretching
  • Thickness: 4mm-6.5mm for Top/Bottom Cushion Pad, 1.5-2.0mm for Middle Layer Cushion Pad
  • Buffer Standard: ≥ 12%, providing excellent cushioning and shock absorption
  • High Temperature Resistance: ≤ 280℃
  • Service Life: 300-500 cycles
  • Available in white, black, or yellow colors
Technical Specifications
Parameter Specification
Material Rubber
Tensile Strength ≥ 25 MPa
High Temperature Resistance ≤ 280℃
Service Life 300-500 Times
Buffer Standard ≥ 12%
Available Colors White, Black, Yellow
Standard Sizes 1500×1300mm, 1300×780mm, 1170×690mm, 1160×665mm, 1180×660mm, 1295×788mm
Shape Square
Applications
The EastStar Hot Press Cushion Pad (Model: ESCP-PCB-G2) is specifically designed for rigid printed circuit board manufacturing. It serves as a critical intermediate layer between press plates and PCB stack-ups, ensuring uniform pressure distribution during hot press lamination. This prevents damage to delicate PCB layers and improves overall product quality and reliability.
Frequently Asked Questions
What is the brand and model number of the Hot Press Cushion Pad?
The Hot Press Cushion Pad is branded EastStar, and the model number is ESCP-PCB-G2.
Where is the Hot Press Cushion Pad manufactured?
The product is made in China.
What is the minimum order quantity?
The minimum order quantity is 10 pieces.
How is the product packaged for shipment?
The Hot Press Cushion Pad is packaged in an exported plywood case to ensure safe delivery.
What are the payment terms and delivery time?
Payment is made via T/T (Telegraphic Transfer), and delivery takes about 10-15 days after receiving prepayment.