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Hot Press Cushion Pad with ≥ 25 MPa Tensile Strength and ≥ 12% Buffer Standard for 300-500 Times Service Life in PCB Lamination

Product Details

Place of Origin: China

Brand Name: EastStar

Model Number: ESCP-PCB-G2

Payment & Shipping Terms

Minimum Order Quantity: 10pcs

Price: Negotiable

Packaging Details: exported plywood case

Delivery Time: about 10-15days after getting prepayment

Payment Terms: T/T

Get Best Price
Highlight:

≥ 25 MPa Tensile Strength Hot Press Cushion Pad

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≥ 12% Buffer Standard PCB Press Cushion Pad

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300-500 Times Service Life Buffering Pad

Weight:
Based On The Size And Thickness
Service Life:
300-500 Times
High Temperature Resistance Performance:
≤280℃
Material:
Rubber
Shape:
Square
Usage:
Rigid Printed Circuit Board Lamination
Buffer Standard: :
≥ 12%
Tensile Strength::
≥ 25 MPa
Weight:
Based On The Size And Thickness
Service Life:
300-500 Times
High Temperature Resistance Performance:
≤280℃
Material:
Rubber
Shape:
Square
Usage:
Rigid Printed Circuit Board Lamination
Buffer Standard: :
≥ 12%
Tensile Strength::
≥ 25 MPa
Hot Press Cushion Pad with ≥ 25 MPa Tensile Strength and ≥ 12% Buffer Standard for 300-500 Times Service Life in PCB Lamination
Hot Press Cushion Pad for PCB Lamination
This high-performance lamination pad features tensile strength ≥ 25 MPa and buffer standard ≥ 12%, designed for superior protection and long-lasting durability in rigid printed circuit board manufacturing.
Product Overview
The Hot Press Cushion Pad is an essential accessory engineered specifically for the lamination process of rigid printed circuit boards (PCBs). This reliable printed circuit board press pad ensures uniform pressure distribution and optimal heat conduction during pressing operations.
As a buffering pad, it protects delicate PCB layers from mechanical stress and thermal damage, enhancing the quality and durability of final products. With a service life of 300-500 pressing cycles, it offers cost-effective performance for multiple production runs.
Key Features
  • Product Name: Hot Press Cushion Pad
  • Buffer Standard: ≥ 12%
  • Service Life: 300-500 cycles
  • Water Absorption: < 8% (3-8%)
  • Standard Sizes: 1500×1300mm, 1300×780mm, 1170×690mm, 1160×665mm, 1180×660mm, 1295×788mm
  • Usage: Rigid Printed Circuit Board Lamination
  • High-quality construction for durability and performance
Technical Specifications
Standard Sizes 1500×1300mm, 1300×780mm, 1170×690mm, 1160×665mm, 1180×660mm, 1295×788mm
Material Rubber
Color Options White, Black, or Yellow
High Temperature Resistance ≤ 280℃
Weight Based on size and thickness
Service Life 300-500 cycles
Usage Rigid Printed Circuit Board Lamination
Buffer Standard ≥ 12%
Water Absorption < 8% (3-8%)
Shape Square
Applications
The EastStar Hot Press Cushion Pad (model ESCP-PCB-G2) is manufactured in China and designed specifically for rigid PCB lamination processes. Made from premium rubber material with excellent elasticity and resilience, it ensures consistent pressure distribution and protection for delicate PCB layers.
Available in multiple standard sizes, this versatile buffering pad is suitable for PCB fabrication facilities, electronics assembly plants, and R&D laboratories. The product is packaged in export-grade plywood cases for secure delivery.
Frequently Asked Questions
What is the brand and model number of the Hot Press Cushion Pad?
Manufactured by EastStar with model number ESCP-PCB-G2.
Where is the Hot Press Cushion Pad made?
The product is made in China.
What is the minimum order quantity?
Minimum order quantity is 10 pieces.
How is the product packaged for shipment?
Packaged in exported plywood cases to ensure safe delivery.
What are the payment terms and delivery time?
Payment via T/T (Telegraphic Transfer) with delivery in 10-15 days after prepayment.
Is the price fixed?
Price is negotiable based on order quantity and other factors.