Productdetails
Merknaam: Estar
Model Number: ESCP-CCL-G1
Betaling & het Verschepen Termijnen
Features: |
Nano High Temperature Resistant Coating |
Hypoallergenic: |
Yes |
Dimensions: |
100mm X 100mm |
Surfacetexture: |
Smooth |
Flexibility: |
Flexible And Elastic |
Coating Type: |
Nano High Temperature Resistant Coating |
Buffer Standard: |
≥ 12% |
Durability: |
High Wear Resistance |
Features: |
Nano High Temperature Resistant Coating |
Hypoallergenic: |
Yes |
Dimensions: |
100mm X 100mm |
Surfacetexture: |
Smooth |
Flexibility: |
Flexible And Elastic |
Coating Type: |
Nano High Temperature Resistant Coating |
Buffer Standard: |
≥ 12% |
Durability: |
High Wear Resistance |
The Lamination Pad is an essential industrial component designed specifically for use in lamination machines, serving a critical role in pressure distribution during the lamination process. Manufactured with precision in China, this pad features high-quality construction and superior performance characteristics, making it a reliable choice for industrial applications involving copper clad laminate (CCL) materials.
With its smooth surface texture, the pad ensures even contact and pressure application across the entire surface of copper clad laminate, which is vital for achieving uniform lamination results without damaging delicate materials. The hypoallergenic nature provides safety and comfort for operators in industrial environments.
| Parameter | Specification |
|---|---|
| Product Name | Lamination Pad |
| Coating Type | Nano High Temperature Resistant Coating |
| Surface Texture | Smooth |
| Dimensions | 100mm X 100mm |
| Buffer Standard | ≥ 12% |
| Durability | High Wear Resistance |
| Thickness Tolerance | ±0.3mm |
| Country of Origin | China |
The Estar ESCP-CCL-G1 Copper Clad Laminate press pad is specifically designed for the demanding requirements of the printed circuit board (PCB) manufacturing industry. This high-quality CCL lamination cushion pad offers uniform pressure distribution during lamination processes, resulting in flawlessly bonded copper clad laminates.
Widely used in high-precision PCB prototyping, small to medium batch production, and quality control testing phases. Particularly effective in scenarios where uniform pressure and heat distribution are critical to achieving optimal adhesion between copper layers and substrate materials.
Estar offers customized services for the Lamination Pad (model ESCP-CCL-G1) designed to meet specific needs. This flexible and elastic CCL cushion mat provides precise cushioning with ±0.3mm thickness tolerance, protecting materials during the lamination process.