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High Temperature Resistant Hot Press Cushion Pad with Tensile Strength ≥ 25 MPa and Water Absorption < 8% for PCB Lamination

Name: High Temperature Resistant Hot Press Cushion Pad with Tensile Strength ≥ 25 MPa and Water Absorption < 8% for PCB Lamination
Brand: Eaststar New Material (Tianjin) Limited
SKU: ESCP-PCB-G2
Price: 50.00 USD
Availability: InStock

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Place of Origin: China

브랜드 이름: EastStar

Model Number: ESCP-PCB-G2

지불과 운송 용어

Minimum Order Quantity: 10pcs

가격: 협상 가능

Packaging Details: exported plywood case

Delivery Time: about 10-15days after getting prepayment

Payment Terms: T/T

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                                                                                                                                                                                                                                                                                                                High Temperature Resistant Hot Press Cushion Pad, Tensile Strength ≥ 25 MPa Lamination Press Pad, Water Absorption < 8% PCB Press Cushion Mat
                              

Shape:	Square	Water absorption standard ::	< 8% (3-8%)
High temperature resistance performance:	≤280℃	Usage:	Rigid Printed Circuit Board Lamination
Tensile strength::	≥ 25 MPa	Service life:	300-500 Times
Color:	White,black Or Yellow	Thickness:	4mm-6.5mm (for Top/bottom Cushion Pad)/1.5-2.0mm (for Middle Layer Cushion Pad).

Shape:	Square
Water absorption standard ::	< 8% (3-8%)
High temperature resistance performance:	≤280℃
Usage:	Rigid Printed Circuit Board Lamination
Tensile strength::	≥ 25 MPa
Service life:	300-500 Times
Color:	White,black Or Yellow
Thickness:	4mm-6.5mm (for Top/bottom Cushion Pad)/1.5-2.0mm (for Middle Layer Cushion Pad).

High Temperature Resistant Hot Press Cushion Pad with Tensile Strength ≥ 25 MPa and Water Absorption < 8% for PCB Lamination

Hot Press Cushion Pad for Industrial Lamination

Essential accessory designed to enhance efficiency and ensure high-quality results in various industrial lamination processes. Manufactured from premium rubber material for excellent durability and reliability.

Product Features

Product Name: Hot Press Cushion Pad
Material: High-quality Rubber
Available Sizes: 1500×1300mm, 1300×780mm, 1170×690mm, 1160×665mm, 1180×660mm, 1295×788mm
Tensile Strength: ≥ 25 MPa for durability and reliability
Thickness Options: 4mm-6.5mm (Top/Bottom Cushion Pads), 1.5mm-2.0mm (Middle Layer Cushion Pads)
Shape: Square design for uniform pressure distribution
Ideal Use: Printed circuit board press pad and lamination pad

Technical Specifications

Parameter	Specification
Available Sizes	1500×1300 / 1300×780 / 1170×690 / 1160×665 / 1180×660 / 1295×788 mm
Water Absorption	< 8% (3-8%)
High Temperature Resistance	≤ 280℃
Service Life	300-500 Cycles
Tensile Strength	≥ 25 MPa
Color Options	White, Black or Yellow
Primary Usage	Rigid Printed Circuit Board Lamination
Material	Rubber
Thickness	4mm-6.5mm (Top/Bottom) / 1.5-2.0mm (Middle Layer)

Applications

Specifically designed for pressing applications in printed circuit board production and processing. The EastStar ESCP-PCB-G2 model provides uniform pressure distribution during rigid PCB lamination, ensuring integrity and quality of multilayer boards.

Ideal for electronics manufacturing facilities requiring precision and reliability in high-temperature pressing environments up to 280℃. Suitable for repetitive industrial use with excellent deformation and damage resistance.

Frequently Asked Questions

What is the brand and model number of this Hot Press Cushion Pad?

The Hot Press Cushion Pad is branded EastStar with the model number ESCP-PCB-G2.

Where is the Hot Press Cushion Pad manufactured?

This product is made in China.

What is the minimum order quantity for the Hot Press Cushion Pad?

The minimum order quantity is 10 pieces.

How is the Hot Press Cushion Pad packaged for shipment?

The product is packed in an exported plywood case to ensure safe delivery.

What are the payment terms and delivery time for the Hot Press Cushion Pad?

Payment is made via T/T, and delivery time is approximately 10-15 days after receiving prepayment.

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High Temperature Resistant Hot Press Cushion Pad with Tensile Strength ≥ 25 MPa and Water Absorption < 8% for PCB Lamination