PRODUCTS

Home > Products > Hot Press Cushion Pad > High Temperature Resistance ≤280℃ Hot Press Cushion Pad with Tensile Strength ≥ 25 MPa and Water Absorption < 8% for Rigid PCB Lamination

Catagories

Printed Circuit Board Laminate Plate

(11)

Wafer Frame Ring

(14)

Contacts

Contacts: Miss. May Liu

Tel: +86--13820292615

Contact Now

Mail Us

High Temperature Resistance ≤280℃ Hot Press Cushion Pad with Tensile Strength ≥ 25 MPa and Water Absorption < 8% for Rigid PCB Lamination

Name: High Temperature Resistance ≤280℃ Hot Press Cushion Pad with Tensile Strength ≥ 25 MPa and Water Absorption < 8% for Rigid PCB Lamination
Brand: Eaststar New Material (Tianjin) Limited
SKU: ESCP-PCB-G2
Price: 50.00 USD
Availability: InStock

Product Details

Place of Origin: China

Brand Name: EastStar

Model Number: ESCP-PCB-G2

Payment & Shipping Terms

Minimum Order Quantity: 10pcs

Price: Negotiable

Packaging Details: exported plywood case

Delivery Time: about 10-15days after getting prepayment

Payment Terms: T/T

Get Best Price

Product Details

Product Description

Highlight: 
                                                                                                                                                                                                                                                                                                                High Temperature Resistance Hot Press Cushion Pad, Tensile Strength PCB Press Cushion Mat, Water Absorption Rigid PCB Cushion Pad
                              

Normal Regular Sizes:	15001300/ 1300780/ 1170690/ 1160665/ 1180660/ 1295788mm	Usage:	Rigid Printed Circuit Board Lamination
Color:	White,black Or Yellow	Thickness:	4mm-6.5mm (for Top/bottom Cushion Pad)/1.5-2.0mm (for Middle Layer Cushion Pad).
Tensile Strength::	≥ 25 MPa	Shape:	Square
High Temperature Resistance Performance:	≤280℃	Water Absorption Standard ::	< 8% (3-8%)

Normal Regular Sizes:	15001300/ 1300780/ 1170690/ 1160665/ 1180660/ 1295788mm
Usage:	Rigid Printed Circuit Board Lamination
Color:	White,black Or Yellow
Thickness:	4mm-6.5mm (for Top/bottom Cushion Pad)/1.5-2.0mm (for Middle Layer Cushion Pad).
Tensile Strength::	≥ 25 MPa
Shape:	Square
High Temperature Resistance Performance:	≤280℃
Water Absorption Standard ::	< 8% (3-8%)

High Temperature Resistance ≤280℃ Hot Press Cushion Pad with Tensile Strength ≥ 25 MPa and Water Absorption < 8% for Rigid PCB Lamination

Product Overview

The Hot Press Cushion Pad is an essential accessory designed specifically for rigid Printed Circuit Board (PCB) lamination processes. Engineered to withstand demanding high-temperature environments up to ≤280℃, this press pad delivers exceptional performance and durability for electronics manufacturing applications.

Key Features

Product Name: Hot Press Cushion Pad
Usage: Ideal for Rigid Printed Circuit Board Lamination
Shape: Square
Material: High-quality Rubber
Available Colors: White, Black, or Yellow
Water Absorption Standard: Less than 8% (3-8%)
Designed as a reliable rigid PCB press pad
Perfectly suited as a printed circuit board press pad
Functions effectively as a Rigid PCB Cushion Pad

Technical Specifications

Parameter	Specification
Service Life	300-500 Times
Weight	Based On The Size And Thickness
Color	White, Black Or Yellow
Tensile Strength	≥ 25 MPa
Material	Rubber
Usage	Rigid Printed Circuit Board Lamination
Thickness	4mm-6.5mm (for Top/Bottom Cushion Pad) / 1.5-2.0mm (for Middle Layer Cushion Pad)
Water Absorption Standard	< 8% (3-8%)
Buffer Standard	≥ 12%
High Temperature Resistance Performance	≤ 280℃

Applications

The EastStar Hot Press Cushion Pad (model ESCP-PCB-G2) is specifically designed for rigid PCB lamination processes. It ensures even pressure and heat distribution across PCB layers, which is critical for optimal bonding and electrical performance. Available in various standard sizes including 1500×1300mm, 1300×780mm, 1170×690mm, 1160×665mm, 1180×660mm, and 1295×788mm, this cushion pad accommodates different PCB dimensions and production requirements.

Frequently Asked Questions

What is the brand and model number of the Hot Press Cushion Pad?

The Hot Press Cushion Pad is from the brand EastStar, and its model number is ESCP-PCB-G2.

Where is the Hot Press Cushion Pad manufactured?

The Hot Press Cushion Pad is made in China.

What is the minimum order quantity for the Hot Press Cushion Pad?

The minimum order quantity for the Hot Press Cushion Pad is 10 pieces.

How is the Hot Press Cushion Pad packaged for shipment?

The Hot Press Cushion Pad is packaged in an exported plywood case to ensure safe delivery.

What are the delivery time and payment terms for ordering the Hot Press Cushion Pad?

The delivery time is about 10-15 days after receiving the prepayment. The payment terms accepted are T/T (Telegraphic Transfer).

Is the price of the Hot Press Cushion Pad fixed?

The price is negotiable depending on the order quantity and other factors.

Tags:

Lamination Pad

Hot Press Cushion Pad

Lamination Press Rubber Pad

Wood Press Cushion Pad

Solar Rubber Cushion pad

Printed Circuit Board Laminate Plate

Copper Clad Laminate Plate

Carrier Cover Plate

Heat Press Kraft Paper

Laminating Film Roll

Wafer Frame Ring

High Temperature Resistance ≤280℃ Hot Press Cushion Pad with Tensile Strength ≥ 25 MPa and Water Absorption < 8% for Rigid PCB Lamination

High Temperature Resistance Hot Press Cushion Pad

Tensile Strength PCB Press Cushion Mat

Water Absorption Rigid PCB Cushion Pad

PCB Lamination Pad,

buffering pad,

pcb laminate

Industrial Grade Thermal Pad PCB ±0.3mm Tolerance Rubber Hot Press Cushion Pad

Flexible FPCB Hot Press Cushion Pad Bendable PCB Cushion Mat Press Pad

1.5mm - 2.0mm FPC Press Pad Silastic Flexible PCB Cushion Pad

Comprehensive Lightweight Hot Press Cushion Pad Printed Circuit Board Buffering Pad

FPC Copper Clad Laminate Integrate FPCB Cushion Pad Buffering Pad Hot Press

Buffering 1.5 - 2mm Hot Press Cushion Pad Water Absorption Rate 8% Pcb Laminate

Rigid Multilayer PCB Press Cushion Pad Flexible Copper Clad Pcb Board

Chemical Resistanct Grey Hot Press Cushion FPCB Pad Circuit Board Laminate Materials

High Molecular Weight Polymer PCB Press Cushion Pad Rectangular Copper Clad Pcb

Red Hot Press Cushion Pad 100 - 200 Times Circuit Board Laminate

Water Absorent FPC Cushion Mat 25MPa Flexible Copper Clad Laminate

Lamination Pad

Hot Press Cushion Pad

Lamination Press Rubber Pad

Wood Press Cushion Pad

Solar Rubber Cushion pad

Printed Circuit Board Laminate Plate

Copper Clad Laminate Plate