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Hot Press Cushion Pad with ≥ 12% Buffer Standard, ≤280℃ High Temperature Resistance, and ≥ 25 MPa Tensile Strength for PCB Lamination

Name: Hot Press Cushion Pad with ≥ 12% Buffer Standard, ≤280℃ High Temperature Resistance, and ≥ 25 MPa Tensile Strength for PCB Lamination
Brand: Eaststar New Material (Tianjin) Limited
SKU: ESCP-PCB-G2
Price: 50.00 USD
Availability: InStock

Product Details

Place of Origin: China

Brand Name: EastStar

Model Number: ESCP-PCB-G2

Payment & Shipping Terms

Minimum Order Quantity: 10pcs

Price: Negotiable

Packaging Details: exported plywood case

Delivery Time: about 10-15days after getting prepayment

Payment Terms: T/T

Get Best Price

Product Details

Product Description

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                                                                                                                                                                                                                                                                                                                ≥ 12% Buffer Standard Hot Press Cushion Pad, ≤280℃ High Temperature Resistance PCB Press Pad, ≥ 25 MPa Tensile Strength Lamination Cushion Pad
                              

Thickness:	4mm-6.5mm (for Top/bottom Cushion Pad)/1.5-2.0mm (for Middle Layer Cushion Pad).	Usage:	Rigid Printed Circuit Board Lamination
High Temperature Resistance Performance:	≤280℃	Tensile Strength::	≥ 25 MPa
Shape:	Square	Water Absorption Standard ::	< 8% (3-8%)
Color:	White,black Or Yellow	Buffer Standard: :	≥ 12%

Thickness:	4mm-6.5mm (for Top/bottom Cushion Pad)/1.5-2.0mm (for Middle Layer Cushion Pad).
Usage:	Rigid Printed Circuit Board Lamination
High Temperature Resistance Performance:	≤280℃
Tensile Strength::	≥ 25 MPa
Shape:	Square
Water Absorption Standard ::	< 8% (3-8%)
Color:	White,black Or Yellow
Buffer Standard: :	≥ 12%

Hot Press Cushion Pad with ≥ 12% Buffer Standard, ≤280℃ High Temperature Resistance, and ≥ 25 MPa Tensile Strength for PCB Lamination

Hot Press Cushion Pad for PCB Manufacturing

The Hot Press Cushion Pad is a high-performance accessory designed to enhance PCB lamination processes. This durable buffering pad provides superior cushioning and protection during pressing operations, ensuring optimal results and extended equipment lifespan.

Key Features

Product Name: Hot Press Cushion Pad
Water Absorption: < 8% (3-8%) for excellent moisture resistance
Available Colors: White, Black, or Yellow
Standard Sizes: 1500×1300mm, 1300×780mm, 1170×690mm, 1160×665mm, 1180×660mm, 1295×788mm
Service Life: 300-500 pressing cycles for long-lasting performance
Specifically designed for rigid PCB press pad applications
Ensures optimal pressure distribution during PCB processing

Technical Specifications

Service Life	300-500 Cycles
Application	Rigid Printed Circuit Board Lamination
Buffer Standard	≥ 12%
High Temperature Resistance	≤ 280℃
Standard Sizes	1500×1300 / 1300×780 / 1170×690 / 1160×665 / 1180×660 / 1295×788 mm
Water Absorption	< 8% (3-8%)
Tensile Strength	≥ 25 MPa
Thickness	4mm-6.5mm (Top/Bottom) / 1.5-2.0mm (Middle Layer)
Color Options	White, Black or Yellow
Weight	Based on size and thickness requirements

Applications

The EastStar ESCP-PCB-G2 Hot Press Cushion Pad is specifically engineered for rigid PCB manufacturing processes. Its excellent thermal resistance (up to 280℃) and durable rubber construction make it ideal for lamination machines, hot pressing equipment, and electronics production lines. The square shape ensures uniform pressure distribution, protecting delicate PCB layers during high-temperature pressing operations.

Frequently Asked Questions

What is the brand and model number?

Brand: EastStar, Model: ESCP-PCB-G2

Where is this product manufactured?

Manufactured in China

What is the minimum order quantity?

Minimum order: 10 pieces

How is the product packaged?

Packed in exported plywood cases for secure shipping

What are the payment and delivery terms?

Payment via T/T, delivery within 10-15 days after prepayment

Is the price fixed?

Price is negotiable based on order quantity and specifications

Tags:

Lamination Pad