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Hot Press Cushion Pad with ≥ 25 MPa Tensile Strength and ≥ 12% Buffer Standard for PCB Lamination with ≤280℃ High Temperature Resistance

Product Details

Place of Origin: China

Brand Name: EastStar

Model Number: ESCP-PCB-G2

Payment & Shipping Terms

Minimum Order Quantity: 10pcs

Price: Negotiable

Packaging Details: exported plywood case

Delivery Time: about 10-15days after getting prepayment

Payment Terms: T/T

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Highlight:

≥ 25 MPa Tensile Strength Hot Press Cushion Pad

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≥ 12% Buffer Standard PCB Lamination Pad

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≤280℃ High Temperature Resistance Buffering Pad

Tensile Strength::
≥ 25 MPa
Shape:
Square
Normal Regular Sizes:
1500*1300/ 1300*780/ 1170*690/ 1160*665/ 1180*660/ 1295*788mm
Buffer Standard: :
≥ 12%
Color:
White,black Or Yellow
Usage:
Rigid Printed Circuit Board Lamination
Thickness:
4mm-6.5mm (for Top/bottom Cushion Pad)/1.5-2.0mm (for Middle Layer Cushion Pad).
High Temperature Resistance Performance:
≤280℃
Tensile Strength::
≥ 25 MPa
Shape:
Square
Normal Regular Sizes:
1500*1300/ 1300*780/ 1170*690/ 1160*665/ 1180*660/ 1295*788mm
Buffer Standard: :
≥ 12%
Color:
White,black Or Yellow
Usage:
Rigid Printed Circuit Board Lamination
Thickness:
4mm-6.5mm (for Top/bottom Cushion Pad)/1.5-2.0mm (for Middle Layer Cushion Pad).
High Temperature Resistance Performance:
≤280℃
Hot Press Cushion Pad with ≥ 25 MPa Tensile Strength and ≥ 12% Buffer Standard for PCB Lamination with ≤280℃ High Temperature Resistance
Hot Press Cushion Pad for PCB Lamination
Product Overview

The Hot Press Cushion Pad is an essential accessory designed specifically for the PCB laminating process, providing excellent performance and durability for professionals involved in printed circuit board manufacturing. This high-quality printed circuit board press pad serves as a reliable buffering pad during the lamination process, ensuring even pressure distribution and protection of delicate components.

Key Features
  • Exceptional service life of 300-500 uses for long-lasting performance
  • Available in white, black, or yellow to suit operational preferences
  • High tensile strength of ≥ 25 MPa for reliable performance under pressure
  • Variable weight based on size and thickness for customizable applications
  • Square shape for uniform pressure distribution and easy handling
Technical Specifications
Parameter Specification
Standard Sizes 1500×1300mm, 1300×780mm, 1170×690mm, 1160×665mm, 1180×660mm, 1295×788mm
Thickness 4mm - 6.5mm (Top/Bottom) / 1.5mm - 2.0mm (Middle Layer)
Usage Rigid Printed Circuit Board Lamination
Color Options White, Black, Yellow
Tensile Strength ≥ 25 MPa
Material High-Quality Rubber
High Temperature Resistance ≤ 280℃
Water Absorption < 8% (3-8%)
Buffer Standard ≥ 12%
Shape Square
Applications

The EastStar Hot Press Cushion Pad (Model: ESCP-PCB-G2) is specifically designed for rigid printed circuit board lamination processes. Its precise thickness options and square shape make it highly versatile for different lamination press requirements in PCB fabrication plants and electronics assembly lines.

Frequently Asked Questions
What is the brand and model number?
Manufactured by EastStar, Model: ESCP-PCB-G2
Where is this product made?
Made in China
What is the minimum order quantity?
Minimum order quantity is 10 pieces
How is it packaged for shipping?
Packaged in exported plywood cases for safe delivery
What are the payment terms and delivery time?
Payment via T/T with delivery in 10-15 days after prepayment
Is the price fixed?
Price is negotiable based on order quantity