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Water absorption below 8% Hot Press Cushion Pad with Buffer Standard ≥ 12% and Tensile Strength ≥ 25 MPa for PCB Lamination

Product Details

Place of Origin: China

Brand Name: EastStar

Model Number: ESCP-PCB-G2

Payment & Shipping Terms

Minimum Order Quantity: 10pcs

Price: Negotiable

Packaging Details: exported plywood case

Delivery Time: about 10-15days after getting prepayment

Payment Terms: T/T

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Highlight:

Water absorption below 8% Hot Press Cushion Pad

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Buffer standard ≥ 12% Lamination Press Rubber Pad

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Tensile strength ≥ 25 MPa PCB Press Cushion Mat

Normal Regular Sizes:
1500*1300/ 1300*780/ 1170*690/ 1160*665/ 1180*660/ 1295*788mm
Usage:
Rigid Printed Circuit Board Lamination
Weight:
Based On The Size And Thickness
Water Absorption Standard ::
< 8% (3-8%)
Material:
Rubber
Color:
White,black Or Yellow
Shape:
Square
Tensile Strength::
≥ 25 MPa
Normal Regular Sizes:
1500*1300/ 1300*780/ 1170*690/ 1160*665/ 1180*660/ 1295*788mm
Usage:
Rigid Printed Circuit Board Lamination
Weight:
Based On The Size And Thickness
Water Absorption Standard ::
< 8% (3-8%)
Material:
Rubber
Color:
White,black Or Yellow
Shape:
Square
Tensile Strength::
≥ 25 MPa
Water absorption below 8% Hot Press Cushion Pad with Buffer Standard ≥ 12% and Tensile Strength ≥ 25 MPa for PCB Lamination
Hot Press Cushion Pad for Rigid PCB Lamination
The Hot Press Cushion Pad is an essential industrial accessory designed specifically for heat pressing and lamination processes. Manufactured from high-quality rubber, this durable lamination press pad delivers consistent performance with a service life of 300-500 cycles. Engineered to provide optimal cushioning and heat distribution, it features multiple thickness options to accommodate various lamination requirements.
Product Features
  • Product Name: Hot Press Cushion Pad
  • Service Life: 300-500 press cycles
  • Weight: Varies by size and thickness
  • Tensile Strength: ≥ 25 MPa
  • Buffer Standard: ≥ 12%
  • Available Colors: White, Black, or Yellow
  • High-performance design for durability and efficiency
  • Effective buffering to protect delicate components
  • Ideal for printed circuit board manufacturing
Technical Specifications
Usage Rigid Printed Circuit Board Lamination
Weight Based on size and thickness
Standard Sizes 1500×1300mm, 1300×780mm, 1170×690mm, 1160×665mm, 1180×660mm, 1295×788mm
Material Rubber
Buffer Standard ≥ 12%
Water Absorption < 8% (3-8%)
Thickness 4mm-6.5mm (Top/Bottom Pad)
1.5-2.0mm (Middle Layer Pad)
Temperature Resistance ≤ 280℃
Shape Square
Service Life 300-500 cycles
Applications
The EastStar ESCP-PCB-G2 Hot Press Cushion Pad is specifically designed for rigid printed circuit board lamination processes. It ensures even pressure distribution and excellent heat resistance during pressing operations, making it essential for electronics manufacturing plants and PCB fabrication facilities. The pad's high-temperature resistance up to 280℃ and multiple size options provide versatility for various industrial pressing requirements.
Frequently Asked Questions
What is the brand and model number of the Hot Press Cushion Pad?
Manufactured by EastStar, model number ESCP-PCB-G2.
Where is the Hot Press Cushion Pad made?
This product is manufactured in China.
What is the minimum order quantity?
Minimum order quantity is 10 pieces.
How is the product packaged for shipment?
Packaged in exported plywood cases for safe delivery.
What are the payment terms and delivery time?
Payment via T/T, with delivery in 10-15 days after prepayment.
Is the price fixed?
Price is negotiable based on order quantity and requirements.