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High Temperature Resistance ≤280℃ Hot Press Cushion Pad with Tensile Strength ≥25 MPa and Buffer Standard ≥12% for Rigid PCB Lamination

Product Details

Place of Origin: China

Brand Name: EastStar

Model Number: ESCP-PCB-G2

Payment & Shipping Terms

Minimum Order Quantity: 10pcs

Price: Negotiable

Packaging Details: exported plywood case

Delivery Time: about 10-15days after getting prepayment

Payment Terms: T/T

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Highlight:

High Temperature Resistance Hot Press Cushion Pad

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Tensile Strength PCB Laminating Pad

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Buffer Standard Rigid PCB Press Pad

High Temperature Resistance Performance:
≤280℃
Usage:
Rigid Printed Circuit Board Lamination
Water Absorption Standard ::
< 8% (3-8%)
Buffer Standard: :
≥ 12%
Service Life:
300-500 Times
Tensile Strength::
≥ 25 MPa
Thickness:
4mm-6.5mm (for Top/bottom Cushion Pad)/1.5-2.0mm (for Middle Layer Cushion Pad).
Normal Regular Sizes:
1500*1300/ 1300*780/ 1170*690/ 1160*665/ 1180*660/ 1295*788mm
High Temperature Resistance Performance:
≤280℃
Usage:
Rigid Printed Circuit Board Lamination
Water Absorption Standard ::
< 8% (3-8%)
Buffer Standard: :
≥ 12%
Service Life:
300-500 Times
Tensile Strength::
≥ 25 MPa
Thickness:
4mm-6.5mm (for Top/bottom Cushion Pad)/1.5-2.0mm (for Middle Layer Cushion Pad).
Normal Regular Sizes:
1500*1300/ 1300*780/ 1170*690/ 1160*665/ 1180*660/ 1295*788mm
High Temperature Resistance ≤280℃ Hot Press Cushion Pad with Tensile Strength ≥25 MPa and Buffer Standard ≥12% for Rigid PCB Lamination
High Temperature Resistance Hot Press Cushion Pad
Engineered with tensile strength ≥25 MPa and buffer standard ≥12%, providing exceptional heat resistance up to 280℃ for PCB laminating processes.
Product Overview
The Hot Press Cushion Pad is an essential accessory designed specifically for PCB laminating processes. Engineered to provide optimal performance and durability, this cushion pad plays a critical role in ensuring the quality and precision of printed circuit board press operations.
Key Features
  • Product Name: Hot Press Cushion Pad
  • Material: High-quality rubber for durability and flexibility
  • Water Absorption: Less than 8% (3-8%) ensuring optimal performance
  • Usage: Specifically designed for rigid printed circuit board (PCB) lamination
  • Thickness Options:
    • Top/Bottom Cushion Pad: 4mm - 6.5mm
    • Middle Layer Cushion Pad: 1.5mm - 2.0mm
  • Available Sizes: 1500×1300, 1300×780, 1170×690, 1160×665, 1180×660, 1295×788 mm
  • Ideal for use as a lamination press rubber pad in PCB manufacturing
  • Provides excellent cushioning and support as a Rigid PCB Cushion Pad
  • Enhances lamination quality and reliability for rigid PCB applications
Technical Specifications
Parameter Specification
Color White, Black or Yellow
Buffer Standard ≥ 12%
Water Absorption < 8% (3-8%)
Thickness 4mm-6.5mm (Top/Bottom), 1.5-2.0mm (Middle Layer)
Material Rubber
Shape Square
Usage Rigid Printed Circuit Board Lamination
Service Life 300-500 Pressing Cycles
High Temperature Resistance ≤ 280℃
Tensile Strength ≥ 25 MPa
Applications
The EastStar Hot Press Cushion Pad (Model ESCP-PCB-G2) is specifically engineered for the lamination process of rigid printed circuit boards. This premium cushion pad is designed to meet demanding requirements of high-temperature lamination press applications, making it essential in PCB manufacturing.
Frequently Asked Questions
What is the brand and model number of this Hot Press Cushion Pad?
The Hot Press Cushion Pad is from the brand EastStar, and the model number is ESCP-PCB-G2.
Where is the Hot Press Cushion Pad manufactured?
This product is made in China.
What is the minimum order quantity for the Hot Press Cushion Pad?
The minimum order quantity is 10 pieces.
How is the product packaged for delivery?
The Hot Press Cushion Pad is packaged in an exported plywood case to ensure safe transportation.
What are the payment terms and delivery time for this product?
Payment is accepted via T/T, and the delivery time is approximately 10-15 days after receiving the prepayment.