Eaststar New Material (Tianjin) Limited
products
PRODUCTS
Home > Products > Hot Press Cushion Pad > 1170 by 690 millimeter Hot Press Cushion Pad with Heat Resistance ≤280℃ and Buffer Standard ≥12% for PCB Lamination

1170 by 690 millimeter Hot Press Cushion Pad with Heat Resistance ≤280℃ and Buffer Standard ≥12% for PCB Lamination

Product Details

Place of Origin: China

Brand Name: EastStar

Model Number: ESCP-PCB-G2

Payment & Shipping Terms

Minimum Order Quantity: 10pcs

Price: Negotiable

Packaging Details: exported plywood case

Delivery Time: about 10-15days after getting prepayment

Payment Terms: T/T

Get Best Price
Highlight:

1170 by 690 millimeter Hot Press Cushion Pad

,

Heat Resistance ≤280℃ PCB Lamination Pad

,

Buffer Standard ≥12% Rubber Press Pad

Thickness:
4mm-6.5mm (for Top/bottom Cushion Pad)/1.5-2.0mm (for Middle Layer Cushion Pad).
Water Absorption Standard ::
< 8% (3-8%)
High Temperature Resistance Performance:
≤280℃
Usage:
Rigid Printed Circuit Board Lamination
Color:
White,black Or Yellow
Normal Regular Sizes:
1500*1300/ 1300*780/ 1170*690/ 1160*665/ 1180*660/ 1295*788mm
Buffer Standard: :
≥ 12%
Shape:
Square
Thickness:
4mm-6.5mm (for Top/bottom Cushion Pad)/1.5-2.0mm (for Middle Layer Cushion Pad).
Water Absorption Standard ::
< 8% (3-8%)
High Temperature Resistance Performance:
≤280℃
Usage:
Rigid Printed Circuit Board Lamination
Color:
White,black Or Yellow
Normal Regular Sizes:
1500*1300/ 1300*780/ 1170*690/ 1160*665/ 1180*660/ 1295*788mm
Buffer Standard: :
≥ 12%
Shape:
Square
1170 by 690 millimeter Hot Press Cushion Pad with Heat Resistance ≤280℃ and Buffer Standard ≥12% for PCB Lamination
Hot Press Cushion Pad - 1170×690mm
The Hot Press Cushion Pad is a square lamination press rubber pad measuring 1170×690mm, specifically engineered for rigid printed circuit board (PCB) manufacturing. Crafted from high-quality rubber, this pad delivers exceptional heat resistance and mechanical strength, withstanding temperatures up to 280°C while maintaining structural integrity.
Product Overview
This essential component provides superior buffering capability with a buffer standard of ≥12%, ensuring even pressure distribution across PCB surfaces during the hot press lamination process. Available in white, black, and yellow color options for easy identification of different specifications.
Key Features
  • Product Name: Hot Press Cushion Pad
  • Shape: Square
  • Material: High-quality Rubber
  • Tensile Strength: ≥25 MPa for maximum durability
  • Water Absorption: Less than 8% (3-8%) ensuring stability
  • Designed specifically for Rigid PCB Lamination
  • Effective buffering pad during hot press processes
  • Protects delicate circuit boards from damage
Technical Specifications
Service Life 300-500 Times
Weight Based on Size and Thickness
Material Rubber
Tensile Strength ≥25 MPa
Standard Sizes 1500×1300 / 1300×780 / 1170×690 / 1160×665 / 1180×660 / 1295×788 mm
Buffer Standard ≥12%
Shape Square
Thickness 4mm-6.5mm (Top/Bottom) / 1.5-2.0mm (Middle Layer)
Water Absorption <8% (3-8%)
Temperature Resistance ≤280°C
Applications
The EastStar ESCP-PCB-G2 Hot Press Cushion Pad is essential for rigid PCB manufacturing processes including hot press lamination, multi-layer board production, and thermal pressing operations. It provides uniform pressure distribution and protects delicate components while facilitating efficient heat transfer in electronic manufacturing plants and PCB fabrication facilities.
Frequently Asked Questions
What is the brand and model number of the Hot Press Cushion Pad?
Manufactured by EastStar, model number ESCP-PCB-G2.
Where is the Hot Press Cushion Pad made?
This product is made in China.
What is the minimum order quantity?
Minimum order quantity is 10 pieces.
How is the product packaged for shipping?
Packaged in exported plywood cases for safe delivery.
What are the payment terms and delivery time?
Payment via T/T (Telegraphic Transfer), delivery within 10-15 days after prepayment.
Is the price fixed or negotiable?
Pricing is negotiable based on order quantity and requirements.